- 21g, slow cure, extreme conductivity
- Primarily used as a replacement for solder in bonding applications involving heat-sensitive components or environments. Effective at bonding heat sinks to other components and PCBs. Also provides excellent EMI/RFE shielding, and very effective at filling seems between metal plates.
- Liquid silver conductive epoxy
- Slow cure / high conductivity (8331S)
- Moderate cure / extreme conductivity (8330)
- Slow cure / extreme conductivity (8330S)