Electronix Express

Kester 2331-ZX Flux Pen Neutral Ph Water Soluble 0.33 Fl.oz Designed For Leaded And Lead-free Rework

SKU: 060723

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  • Regular price $7.95


Kester 2331-ZX Flux Pen® is designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. Kester 2331-ZX is an innovation in organic acid water-soluble flux chemistry for soldering circuit board assemblies. This unique, neutral pH chemistry flux provides the best ionic cleanliness of any organic watersoluble flux available to the electronics industry. This popular flux has been used for soldering critical assemblies in the telecommunications, computer and other industries.No offensive odors will be emitted during soldering. Kester 2331-ZX will not create excessive foaming in standard water cleaning systems. Kester 2331-ZXhas good soldering properties for improved productivity without sacrificing reliability of the assembly. This flux does not attack properly cured solder masks or FR-4 epoxy-glass laminate. Kester 2331-ZX is not detrimental to the surface insulation resistance of the soldered assembly. Use of this flux minimizes cleaning costs while complying with environmental regulations.


Performance Characteristics:

  • High activity
  • Chemically compatible with most solder masks and board laminates
  • pH Neutral Chemistry
  • Classified as ORH1 per J-STD-004
  • RoHS Compliance

Physical Properties:

  • Specific Gravity: 0.899 ± 0.005 (Antoine Paar DMA35 @ 25°C)
  • Percent Solids (typical): 33 (Tested to J-STD-004, IPC-TM-650, Method 2.3.34)

Reliability Properties:

  • Copper Mirror Corrosion: High (Tested to J-STD-004, IPC-TM-650, Method 2.3.32)
  • Corrosion Test: High (Tested to J-STD-004, IPC-TM-650, Method 2.6.15)
  • Silver Chromate: Fail (Tested to J-STD-004, IPC-TM-650, Method 2.3.33)
  • Chloride and Bromides: 2.2% (Tested to J-STD-004, IPC-TM-650, Method 2.3.35)
  • Fluorides by Spot Test: Pass (Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1)
  • SIR, IPC (typical): Pass (Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3)